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Polymer Matrix Composites Reinforced with Expanded and Unexpanded Graphite Particles for Electronic Packaging Applications
2013 IEEE 19th Int. Symposium for Design and Technology in Electronic Packaging (SIITME), Galati, Romania, 24-27 Oct. 2013, in Proc. IEEE Catalog No. CFP1307I-ART.

par   I.H. Tavman , A. Turgut , Nicolas HORNY , Mihai CHIRTOC


Thématique du GRESPI concernée par cet article :

          -Thermique